Thrust 1: Additive manufacturing of metals and ceramics
The PI's laboratory has access to multiple instruments, including friction surfacing, an ink-extrusion printer, and laser powder bed fusion, for additive manufacturing of metals and ceramics with intricate structures through solid- and liquid-state processing.
A. Direct Ink Writing
Direct Ink Writing (DIW) enables the additive manufacturing of intricate 3D structures via layer-by-layer deposition. Unlike fusion-based techniques, DIW processes a broad range of materials, including metals, ceramics, and polymers, at lower temperatures using compact, energy-efficient hardware. This method allows printing and synthesis of air-sensitive materials with 3D structures for enhanced functionality. High-entropy superalloys and thermoelectric materials have been printed and synthesized via DIW for high-temperature applications.

Key publications
- M. Chen, D. C. Dunand, et al., Microstructure and properties of high-entropy-superalloy microlattices fabricated by direct ink writing, Acta Materialia (2024), 120055.
- M. Chen, A. Pröschel, et al., Ink casting and 3D-extrusion printing of Yb14MnSb11 for high-temperature thermoelectric material, Advanced Functional Materials (2024), 2415210.
B. Laser powder bed fusion
Laser Powder Bed Fusion (L-PBF) enables the 3D printing of metals, ceramics, and polymers with intricate geometries and high-dimensional precision. The use of selectively blended powders in the L-PBF process can eliminate the need for pre-alloying steps in traditional powder metallurgy, thereby reducing both cost and energy consumption.

Key publications
- M. Chen, S. Van Petegem, et al., Microstructural engineering of a dual-phase Ti-Al-V-Fe alloy via in situ alloying during laser powder bed fusion, Additive Manufacturing (2022), 59, 103173.
- M. Chen, M. Simonelli, D. F. Sanchez, H. Van Swygenhoven, et al., A quantitative study of thermal cycling along the build direction of Ti-6Al-4V produced by laser powder bed fusion, Materials and Design (2023), 225, 111458.



